This product is a 16-layer high-frequency HDI product that integrates both software and hardware. Its special structure is relatively complex. The multilayer stack-up includes signal layers, ground layers (GND), and power layers (GND/power). The large number of layers increases the difficulty of processes such as interlayer alignment and lamination, and also makes it difficult to control material properties. Various materials with different characteristics are used, such as Panasonic RF775 and Shengyi SF305C. Each material has distinct parameters, including dielectric constant (dk) and dissipation factor (df). In high-frequency environments, material properties must be precisely controlled to meet electrical performance requirements. The difference in thermal expansion coefficients between materials can also easily lead to issues like warpage. Via processes have extremely high requirements. There are mechanical vias and micro laser vias. The production of micro laser vias requires high-precision processes such as laser drilling, and has extremely strict demands on equipment and process control. Additionally, the aperture of mechanical via pads and the quality of hole walls can also affect the reliability of electrical connections.